Parthi is a global semiconductor manufacturing and technology executive with two decades of leadership across North America, Asia, and Europe. As Chief Product Officer at L&T Semiconductor Technologies, he leads worldwide semiconductor manufacturing operations, advanced packaging, and technology organizations, including SoC packaging, module integration, and widebandgap power electronics packaging.
He previously served as President & CEO of DunAn Microstaq, Inc., where he drove growth in MEMSbased sensor and actuator technologies and SysteminPackage solutions for sensor drive electronics, expanded global manufacturing partnerships, and advanced sustainability and datadriven innovation. A technologist at his core, Parthi holds 33 U.S. patents and more than 30 international patents in semiconductor devices, packaging, control systems, and control algorithms.
Parthi’s education includes graduate studies at the State University of New York at Binghamton, a Master’s degree in Mechanical Engineering from the University of Arkansas, and both a Master’s and Bachelor’s degree in Mechanical Engineering from Universiti Sains Malaysia, with research focused on electronic packaging and advanced optimization methods.